From October 18 to 21 in Chicago, SACMI Packaging & Chocolate will showcase its leading solutions for primary and secondary packaging, alongside its complete portfolio for the chocolate industry, from processing to moulding and wrapping. On display will be flow-pack solutions, vertical packaging machines and the new ET Pack offering, making its U.S. debut. The event further confirms the strategic importance of the North American market and the strengthening of SACMI’s local organization. Also featured will be SACMI Rigid Packaging technologies for caps and preforms.
SACMI torna protagonista a PACK EXPO International 2026, South Building S-3439, in programma dal 18 al 21 ottobre al McCormick Place di Chicago, con una proposta ancora più ampia per il mondo del packaging.
SACMI will once again be a key player at PACK EXPO International 2026, South Building S-3439, taking place from October 18 to 21 at McCormick Place in Chicago, with an even broader offering for the packaging industry.
SACMI Packaging & Chocolate brings to the United States an increasingly comprehensive portfolio of technologies for primary and secondary packaging, reflecting a growth path that has expanded expertise, product range and the ability to deliver integrated solutions, from standalone machines to complete end-of-line systems.
Performance, flexibility, fast format changeovers, ease of use and simplified maintenance are the key drivers behind the solutions on display. Added to these is a further strategic advantage: proximity to the North American market, where SACMI Packaging & Chocolate continues to invest in strengthening commercial and technical support for its customers.
Chocolate: a complete offering from processing to packaging
At PACK EXPO Chicago, SACMI Packaging & Chocolate will present one of the market’s most complete and integrated offerings for the chocolate and confectionery industry. Thanks to the consolidated expertise of its Carle&Montanari and OPM brands, the portfolio covers the entire production process, from chocolate processing including mixing, refining, conching and tempering, through moulding, and up to wrapping, flow-pack and secondary packaging.
The solutions are designed for a wide variety of products, with technologies configurable according to specific production requirements.
OPM flow-pack: JT-ADVANCE and HP20 for different production needs
In the flow-pack segment, SACMI will showcase two solutions designed for different productivity levels.
JT-ADVANCE is OPM’s premium flow-wrap solution, engineered for applications requiring high speeds, low operating costs and maximum efficiency during format changeovers. Particularly suitable for chocolate bars, cereal bars, snacks and pralines, it achieves wrapping material speeds of up to 150 metres per minute / 1,500 products per minute, while offering tool-less adjustments, excellent accessibility and simplified maintenance.
Alongside it will be HP20, a solution dedicated to applications requiring moderate production speeds, further extending SACMI’s range with a flexible machine capable of meeting diverse packaging requirements.
ET Pack ECOWRAP® ETW201: SACMI expands its secondary packaging portfolio and debuts in the U.S.
PACK EXPO Chicago also marks an important milestone for ET Pack, a company within Emballage Technologies Groupe that joined the SACMI Packaging & Chocolate family at the end of 2025 following SACMI’s majority acquisition of the French group.
ET Pack now officially enters the U.S. market, reinforcing SACMI’s strategy of broadening its secondary packaging offering. On display will be the ECOWRAP® ETW201, a versatile continuous-motion wrap-around case packer designed for quick and easy format changeovers, capable of reaching outputs of up to 80 packs per minute.
Vertical packaging: VPS25C and VPS40C
For vertical packaging applications, SACMI Packaging & Chocolate will present the VPS25C and VPS40C, two continuous-motion solutions designed to combine reliability, flexibility, accessibility and fast cleaning, maintenance and format changeover operations.
Compact and versatile, the VPS25C can be synchronized with different dosing systems and handle a wide variety of packaging styles and product types.
The VPS40C extends the range to applications requiring higher capacities and larger bag sizes, achieving outputs of up to 120 packs per minute. At PACK EXPO it will be displayed in a configuration featuring a gantry system and cup filler, demonstrating SACMI’s ability to integrate individual technologies into complete automated systems.
Closer to the North American market
SACMI Packaging & Chocolate’s participation at PACK EXPO 2026 also reflects the company’s strategic commitment to the U.S. market.
North America represents one of the Business Unit’s priority growth areas, and the strengthening of the local organization reflects SACMI’s determination to be even closer to customers, not only during the sales process but throughout the entire lifecycle of the investment, from project development and commissioning to service and after-sales support.
This strategy is further reinforced by the new leadership of the U.S. division, entrusted in 2026 to Ed Young, with the objective of supporting a new phase of growth for SACMI Packaging & Chocolate USA through direct market presence, the expertise of the local team and an increasingly broad technology portfolio.
SACMI Rigid Packaging: technologies and new standards for caps and preforms
Alongside the Packaging & Chocolate offering, SACMI will also be present in Chicago with its Rigid Packaging Business Unit, a global benchmark in technologies for the production of caps and preforms.
The portfolio combines the well-established CCM (Continuous Compression Moulding) platform for cap production and IPS (Injection Preform System) technology for PET preforms with advanced expertise in product development, automation and quality control.
Particular attention is dedicated to the evolution towards lighter, higher-performing and more sustainable packaging, supported by one of the market’s most extensive portfolios of next-generation cap solutions.
At PACK EXPO Chicago, SACMI presents itself as a global technology partner for the packaging industry, capable of supporting customers from product development and process technology through automation, line integration and service throughout the entire lifecycle of the plant.
PACK EXPO International 2026 – Chicago
McCormick Place – South Building S-3439
October 18-21, 2026